Job Title: Microelectronics Process Engineer (9/80, 1st Shift)

Job Code: SAS20230405-100445

Job Location: Palm Bay, FL

Job Description:

The person filling this position will lead manufacturing related activities on programs and prototype hardware for avionics and space applications. The type of hardware produced at this L3Harris location is often complex, containing circuit card assemblies (CCAs), cable harnesses, multi-chip modules, and higher level system assemblies. This job will have a high emphasis on microelectronics.

Essential Functions:

• Interfacing with design engineers to ensure hardware is producible.
• Assisting with high visibility manufacturing efforts, including formal cost/schedule responsibilities and manufacturing readiness reviews, which may include direct customer interface.
• Leading and supporting microelectronic manufacturing activities throughout the product lifecycle.
• Planning and requesting manpower/equipment/process resources.
• Generating assembly documentation and directing support personnel in the day-to-day execution of the manufacturing tasks.
• Supporting process improvement initiatives of technical and operational nature.
• Designing and developing manufacturing and engineering tools, strategies, and systems.
• Planning and supporting the build and modification of electronic systems in the areas of procurement, assembly method/work instructions generation, tooling design, process development, facilities/equipment planning, and the resolution of manufacturing, quality, and reliability issues.
• Supporting the root cause and corrective action process.

Qualifications:

• Bachelor’s Degree and minimum 4 years of prior relevant experience. Graduate Degree and a minimum of 2 years of prior related experience. In lieu of a degree, minimum of 8 years of prior related experience in Manufacturing Engineering.
• Experience in microelectronics assembly using MIL-STD-883 & MIL-PRF-38534.

Preferred Additional Skills:

• Experience in implementing lean/six sigma techniques (FMEA, APQP, DFMA, DTC, DOE).
• Background in the manufacturing of electronics for high reliability military and government systems.
• Background in development/LRIP manufacturing efforts.
• Background in developing manufacturing processes and transferring those to production.
• Experience with epoxy dispense, component pick and place, wirebonding, hermetic sealing and testing.
• Additional knowledge of MIL/IPC workmanship and performance standards related to electronic assemblies (IPC-610, etc.).
• Knowledge of circuit card assemblies (CCAs) and cable assemblies.
• Good communication skills including the ability to deliver effective presentations to peers, management, and customers.
• Demonstrated ability to find root cause of manufacturing process problems, workmanship defects, mechanical test failures, etc.
• Process Engineering background with equipment knowledge.