Job Title: Lead, Wafer Bonding Process Engineer

Job Code: SAS20231105-100687

Job Location: Palm Bay FL

Job Description:

L3Harris is seeking a Lead Wafer Bonding Process Engineer who is interested in working alongside a talented team of professionals with a focus on establishing, monitoring, and maintaining reproducible wafer bonding processes and implementing yield enhancements with the ability to identify complex problems and implementing solutions. The candidate must have experience working with both manual and automated wafer bonding tools and understands principles of achieving wafer-to-wafer bond alignments with better than 0.5 um accuracies. The ideal candidate will have the ability to perform routine tool maintenance and maintain the wafer bonding tools. The candidate must have a strong background in measuring and analyzing wafer bond strength. The candidate will also communicate technical results and will support internal peer design reviews.

Essential Functions:

• Senior Professional with strong knowledge in wafer bonding process optimization and in depth understanding of fusion, hybrid, and direct bonding technologies
• Experience using automated wafer bonding tools to perform wafer-to-wafer and die-to-wafer bonding
• Qualifies wafer bonding processes on new tools.
• Performs design of experiments (DOE) to improve bond strength, eliminate bond voids, and maximize bond energy
• Perform process centering to maximize yield of bonded wafers and minimize deviations from nominal and actual bond line thickness
• Continually monitors bonding metrics to account for process drift and perform root cause corrective analysis (RCCA) when insufficient bond strength or bond voids occur
• Monitors the wafer bonding process by responding to in-line issues and dispositions of production wafers.
• Coordinates the scheduling of process qualifications and equipment down time with manufacturing or equipment engineering.
• Uses software to analyze data, identify trends to make decisions about processing product.
• Makes adjustments when process parameters are exceeded and monitors process parameters when tools return from maintenance.

Qualifications:

• A Bachelor’s Degree with 10 years of industrial experience or a Master’s Degree in Chemical, Mechanical, Electrical, Materials Science, Physics, or Industrial Engineering with a minimum of 7 years of industrial experience.
• 7+ years of experience with Software Data Analysis software (Matlab, Spotfire, Minitab, JMP, etc.)
• 7+ years of experience with troubleshooting equipment and/or process failures

Preferred Additional Skills:

• PhD in Chemical, Mechanical, Electrical, Materials Science, Physics, or Industrial Engineering
• Prior experience with metrology tools such as atomic force microscopes and scanning acoustic microscopes to analyze surface roughness and bond voids respectively
• Secret or TS Clearance
• Understanding of statistical methods and design of experiments
• Presentation and technical writing skills
• Understanding of Lean, TPS, or 5s principles
• Understanding of root cause corrective action (RCCA)