This position is responsible for managing the US High Performance Contactor (HPC) Engineering team within the Interface Solutions Group (ISG) of Cohu. This position requires collaboration with global customers, Sales and Engineering groups to define, develop and maintain hardware for semiconductor test applications. Hardware designs include spring probes, test sockets, PCB’s, SMT components, Cables, connectors, stiffeners, change kit hardware and lab test fixtures. This position will drive and facilitate the PDP process from prototype to production. Design reviews, cost analysis, budget tracking, implementation of automation, supply chain development, and quality control are required throughout the PDP process to ensure hardware meets timelines, costs and specifications and functions as required in a high-volume semiconductor test environment. This role focuses on turning product concepts into high-volume manufacturable product for final test and wafer test contactors, PCBs, and other interface hardware. Direct customer communication will be required to understand application requirements, explain Cohu’s capabilities, define project scopes, and manage expectations balancing risk and scheduling requirements. Creativity and critical thinking is necessary for this role as many concepts include leading edge technologies may have had little to no implementation in the high volume semiconductor test industry. Engineering projects range from prototypes for new product introduction to ongoing maintenance of customer applications in production, as well a design and development of fixtures and automation hardware for internally evaluating new products prior to shipment. Understanding of basic RF principals of insertion loss and impedance matching is preferred. Supervision and delegation to multiple teams of engineers is part of this management role and therefore leadership and experience with managing people is required.

Essential Duties and Responsibilities include but are not limited to (other duties may be assigned):

• Understanding of high-volume semiconductor contactor design requirements (spring probes, cantilever technology, cross-sections, compliance, force, tip geometries, engineering plastics, probe materials and coatings)
• Experience with a formal Product Development Process including phase gates and requirements such as ROI, FMEA, DOE, risk assessment and manufacturability milestones.
• Managing the mechanical design team in designing test sockets, PCB’s, stiffeners, actuators, change kits, test fixtures and other prototype hardware for characterization of semiconductor devices
• Managing local and remote vendor communications for design and manufacturing of new products
• Working within a global Engineering team (US, EU, Asia) to ensure new products are successfully introduced and maintainable in the local production environment
• Collaborating with Operations globally for continuous design for manufacturability improvements
• Maintaining and/or updating product designs for longevity and robustness in a production environment
• Working with Customers, Sales, Engineering teams to understand project scope, define and direct activities to develop and maintain mechanically robust test interface solutions
• Supervision of a team of R&D and Standard Products Engineers is required.
• Knowledge and understanding of Solidworks 3D CAD software.
• Some travel may be required to support initial installations and maintain customer relationships
• Project management and teamwork responsibilities as necessary
  

Education and/or Experience:

• 4 year Mechanical Engineering Degree (BSME) preferred or equivalent experience
• 10 years engineering design experience in manufacturing environment
• 5-10 years of experience managing a team
• Experience with FMEA, DOE, 3x5why and other PDP and quality processes
• Understanding of contactor and spring probe part fabrication techniques and methods
• 3D CAD modeling experience (Solidworks a plus)
• FEA CAE experience (Ansys Multiphysics a plus)
• Proven experience taking a project from concept to high volume production
• Understanding of LEAN and or Standard Work manufacturing principles and practices
• Familiar with Microsoft Office products including Teams, Project, Excel, Powerpoint and Word, and ERP systems (Oracle and Agile)
• Strong verbal and written communications skills; ability to communicate effectively with both domestic and foreign colleagues/vendors
• Semiconductor/Electronics mechanical design experience a plus
• Experience work with RF theory and concepts a plus
• 10-20% travel required